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Material Issues of the Metal Printing Process, MPP
The metal printing process, MPP; is a novel Rapid Manufacturing process under development
at SINTEF and NTNU in Trondheim, Norway. The process, which aims at the manufacturing
of end-use products for demanding applications in metallic and CerMet materials, consists of
two separate parts; The layer fabrication, based on electrostatic attraction of powder materials,
and the consolidation, consisting of the compression and sintering of each layer in a heated
die. This approach leads to a number of issues regarding the interaction between the process
solutions and the materials. This paper addresses some of the most critical material issues at
the current development stage of MPP, and the present solutions to these.Mechanical Engineerin
SGXIO: Generic Trusted I/O Path for Intel SGX
Application security traditionally strongly relies upon security of the
underlying operating system. However, operating systems often fall victim to
software attacks, compromising security of applications as well. To overcome
this dependency, Intel introduced SGX, which allows to protect application code
against a subverted or malicious OS by running it in a hardware-protected
enclave. However, SGX lacks support for generic trusted I/O paths to protect
user input and output between enclaves and I/O devices.
This work presents SGXIO, a generic trusted path architecture for SGX,
allowing user applications to run securely on top of an untrusted OS, while at
the same time supporting trusted paths to generic I/O devices. To achieve this,
SGXIO combines the benefits of SGX's easy programming model with traditional
hypervisor-based trusted path architectures. Moreover, SGXIO can tweak insecure
debug enclaves to behave like secure production enclaves. SGXIO surpasses
traditional use cases in cloud computing and makes SGX technology usable for
protecting user-centric, local applications against kernel-level keyloggers and
likewise. It is compatible to unmodified operating systems and works on a
modern commodity notebook out of the box. Hence, SGXIO is particularly
promising for the broad x86 community to which SGX is readily available.Comment: To appear in CODASPY'1
Surface embedded temperature sensor on tool part for real time injection moulding process monitoring
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